Tue, Apr 09, 2013 @ 04:31 PM
Thermal slide debonding represents the next significant advancement in obtaining high-yield thin wafer results. Initial detection of anomalies and cracks usually occurs during debonding; however, many causes for this damage originate during upstream bonding material coating, curing, bonding, and thinning processes. Moreover, only thermal separation tools that are highly precise and highly accurate will consistently render desirable process yields. The bonded pair is subjected to many thermal and compressive forces during processing and debonding. The thinned device layers are often very sensitive to outside factors including temperature, vacuum, and mechanical compression and release.
For debonding, relatively speaking, silicon materials are inherently more flexible than III-V compounds and allow greater control tolerances. Consequently compound semiconductor (CS) materials require significantly tighter control of platen temperature uniformity, pull force, vacuum fluctuations, platen separation, and platen co-planarity. The Cee® 1300CSX thermal slide debonder (see image below) has been specifically designed to meet and exceed these specifications.
In this tool, wafer stacks are processed with the thinned device wafer orientated to contact the upper chuck and the carrier substrate is held in place by a vacuum emanating from the lower chuck. A manual insertion tool accurately aligns the bonded pair onto the lower platen lift pins. The lift pins are programmed electronically and provide precisely controlled acceleration for bringing the substrate to the desired set point temperature for heating the thermoplastic bonding material to the appropriate temperature to achieve a viscosity of <300 Pa·s. The following steps outline the standard process flow for thermal separation (see diagram below).
Operating the debonder involves the following processing steps:
Transferring the intact device to a post-debonding spin-cleaning tool is the next critical step. The most common transfer method is outlined below:
Brewer Science is uniquely positioned to seamlessly integrate the materials, processes, and machines for adopting a precision temporary thermal bonding/debonding application. Our product portfolio includes high-temperature temporary bonding materials (WaferBOND® HT-10.10 material), precision spin coaters (Cee® 200X and 300X tools), bake plates (Cee®1300X and 200CBX tools), temporary bonders, debonders (Cee®1300DB and 1300CSX tools), thin-wafer transfer tooling, and cleaning tools (Cee®200XD, 300XD, and 300MXD tools). Please contact us today to learn more about these advanced technologies and products for overcoming daunting process challenges. We are standing by to assist you.
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