--- title: The unsung hero of the next technological generation description: To shrink feature sizes and introduce full-scale 3D integration, the substrates on which integrated circuits are printed must obviously become thinner image: https://blog.brewerscience.com/hs-fs/hub/51396/file-2539352011.png --- [![BrewerScienceLogo-Horizontal.png](https://blog.brewerscience.com/hs-fs/hubfs/BrewerHorizontal-White.png?width=1330&name=BrewerHorizontal-White.png "BrewerScienceLogo-Horizontal.png")](https://blog.brewerscience.com) - [Research](https://www.brewerscience.com/research/) - [Overview](https://www.brewerscience.com/research/overview/) - [Patents](https://www.brewerscience.com/research/patents/) - [Publications](https://www.brewerscience.com/research/patents/) - [Processing Theories](https://www.brewerscience.com/processing-theories/spin-coat/) - [Trademarks](https://www.brewerscience.com/research/trademarks/) - [Products](https://www.brewerscience.com/products/) - [Protective Coatings](https://www.brewerscience.com/products/protective-coatings/) - 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[trilayer (1)](https://blog.brewerscience.com/topic/trilayer) - [trilayer resist process (1)](https://blog.brewerscience.com/topic/trilayer-resist-process) - [ultrathin wafers (1)](https://blog.brewerscience.com/topic/ultrathin-wafers) - [unilayer processing (1)](https://blog.brewerscience.com/topic/unilayer-processing) - [unplugged (1)](https://blog.brewerscience.com/topic/unplugged) - [wafer problems (1)](https://blog.brewerscience.com/topic/wafer-problems) - [water (1)](https://blog.brewerscience.com/topic/water) - [wearable devices (1)](https://blog.brewerscience.com/topic/wearable-devices) - [wearable solar (1)](https://blog.brewerscience.com/topic/wearable-solar) - [wireless headphones (1)](https://blog.brewerscience.com/topic/wireless-headphones) - [workplace safety (1)](https://blog.brewerscience.com/topic/workplace-safety) - [zero landfill (1)](https://blog.brewerscience.com/topic/zero-landfill) # The unsung hero of the next technological generation [Brewer Science](https://blog.brewerscience.com/author/brewer-science) Jan 17, 2017 ### Subscribe to Our Blog As we push to shrink feature sizes and introduce full-scale 3D integration, the substrates on which integrated circuits are printed must obviously become thinner. Much thinner. While shaving down the substrates to less than 100 micrometers thick is a readily available process, moving to even thinner device substrates (<50 µm) makes for an extremely fragile device. The stress of the thinning process and subsequent downstream metallization processes can cause the ultrathin wafers to bow or even break. That’s why [temporary bonding](https://blog.brewerscience.com/what-is-temporary-bonding-and-why-is-it-needed) is one of the unsung heroes of ultrathin wafer manufacturing. It’s a process used to stabilize an ultrathin wafer through harsh back-end production while allowing the wafer itself to remain…well…ultrathin. While there are many bonding and debonding materials in the Brewer Science pantheon, we’re going to focus on two today. **Mechanical release**   ![mechanical-release-illustration.png](https://blog.brewerscience.com/hs-fs/hub/51396/file-2618901031.png?width=175&name=file-2618901031.png) Mechanical release could be the simplest method of debonding since it makes it possible to separate wafers with little to no force. Brewer Science’s BrewerBOND® 530 material is perfect for mechanical release because it makes room-temperature debonding a breeze. It employs a specially treated (and reusable) carrier that simply adheres to the wafer and separates away at the end of the process. In addition, it’s easily the most versatile of all our bonding and debonding materials and boasts a high temperature survivability of up to 300°C. And although separating wafers doesn’t always denote stability and strength, this mechanical process remains an extremely low-stress method at a relatively low cost of ownership. **Laser release**   ![laser-release-illustration.png](https://blog.brewerscience.com/hs-fs/hub/51396/file-2630450477.png?width=173&name=file-2630450477.png) If this method sounds cool and futuristic, that’s because it is. The laser release method (using BrewerBOND® 701 material) employs a special release layer between the carrier and wafer that breaks down when it’s exposed to an excimer laser. This method is exciting for several reasons. *Very-low-stress* This method exerts almost no stress on the wafer, making it a perfect fit for even the thinnest of substrates. *Thermal stability* Laser debonding using BrewerBOND® 701 material offers temperature survivability up to 400°C, making it ideal for high-stress and high-temperature processing. *Throughput* BrewerBOND® 701 material is suitable for very high volume production. It allows you to process up to 50 wafers per hour, twice that of our next quickest debonding process. **The right process** From where we’re sitting, these two processes are going to emerge as the most appropriate processes for the next generation of technologies. [Contact a Brewer Science expert](http://www.brewerscience.com/contact/) to see which process might be right for your organization. [temporary wafer bonding](https://blog.brewerscience.com/topic/temporary-wafer-bonding), [laser release](https://blog.brewerscience.com/topic/laser-release), [ultrathin wafers](https://blog.brewerscience.com/topic/ultrathin-wafers), [mechanical release](https://blog.brewerscience.com/topic/mechanical-release) [3 places where solar energy is having a tremendous impact](https://blog.brewerscience.com/3-places-where-solar-energy-is-having-a-tremendous-impact) [Advances in optical simulations: How thinking small is fixing big problems](https://blog.brewerscience.com/advances-in-optical-simulations-how-thinking-small-is-fixing-big-problems) ### About Author ![Brewer Science](https://blog.brewerscience.com/hubfs/brewersciencebuilding.jpg) Brewer Science Brewer Science is a global technology leader in developing and manufacturing innovative materials, and processes for the fabrication of semiconductors and microelectronic devices. In 1981, Brewer Science revolutionized lithography processes with its invention of Brewer Science® ARC® anti-reflective coatings. Today, we continue to expand our technology portfolio to include products that enable advanced lithography, 3-D integration, chemical and mechanical device protection, nanotechnology, and thin wafer handling. With its headquarters in Rolla, Missouri, Brewer Science supports customers throughout the world with a service and distribution network in North America, Europe and Asia. Related Posts - - - - ### Comment ## Subscribe To Blog ### Subscribe to Email Updates ### contact **Brewer Science, Inc.** 2401 Brewer Dr. Rolla, MO 65401 Call us: ([573)364-0300](tel:+1800123456) ### support At Brewer Science, our customer relationships don’t end when you buy materials and equipment. Because we want to work hand-in-hand to get your processes perfect, we’ve empowered an extensive applications and support team to help with all your processing needs. [SUPPORT@BREWERSCIENCE.COM](mailto:SUPPORT@BREWERSCIENCE.COM) [Locations](https://blog.brewerscience.com/about-us/locations/) ### Recent Posts ### connect with us @ 2018 Brewer Science, inc.