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Thermal slide debonding represents the next significant advancement in obtaining high-yield thin wafer results. Initial detection of anomalies and cracks usually occurs during debonding; however,..

Thin-wafer processing trends

Several spin-coating process applications require the ability to uniformly coat, develop, and/or rinse (clean) thinned and fragile substrates. Safely handling these..

Limitations of Moore's Law

Ultimately, performance of computers and other electronic products will be limited by transistor size and density. Because the semiconductor industry has pushed to..