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One of the most critical variables in spin-coating processes is coating uniformity. In many cases, engineers are challenged with achieving ultralow total thickness variation at high film thicknesses..

Thin-wafer processing trends

Several spin-coating process applications require the ability to uniformly coat, develop, and/or rinse (clean) thinned and fragile substrates. Safely handling these..

A variety of factors can affect the coat quality when spin processing. This article will focus on the role that the bowl environment, and in particlar the ability to control the fume exhaust, has on..