--- title: 2018 Outlook for Advanced Packaging Materials description: Advanced packaging is moving mainstream as manufacturers continue to seek ways to improve device performance beyond traditional scaling. --- [![BrewerScienceLogo-Horizontal.png](https://blog.brewerscience.com/hs-fs/hubfs/BrewerHorizontal-White.png?width=1330&name=BrewerHorizontal-White.png "BrewerScienceLogo-Horizontal.png")](https://blog.brewerscience.com) - [Research](https://www.brewerscience.com/research/) - [Overview](https://www.brewerscience.com/research/overview/) - [Patents](https://www.brewerscience.com/research/patents/) - [Publications](https://www.brewerscience.com/research/patents/) - [Processing Theories](https://www.brewerscience.com/processing-theories/spin-coat/) - [Trademarks](https://www.brewerscience.com/research/trademarks/) - [Products](https://www.brewerscience.com/products/) - [Protective Coatings](https://www.brewerscience.com/products/protective-coatings/) - [Alkaline Protective Coatings](https://www.brewerscience.com/products/protek-b3/) - [Photosensitive Protective coatings](https://www.brewerscience.com/products/protek-psb/) - [Wafer-Level Packaging](https://www.brewerscience.com/product-categories/wafer-level-packaging/) - [Bonding Materials](https://www.brewerscience.com/products/brewerbond-materials/) - [Debonding Materials](https://www.brewerscience.com/products/debonding-technologies/) - [Lithography](https://www.brewerscience.com/product-categories/lithography/) - [Anti-reflective Coatings](https://www.brewerscience.com/products/arc/) - [Directed Self-Assembly](https://www.brewerscience.com/products/directed-self-assembly/) - [Multilayer Systems](https://www.brewerscience.com/products/multilayer/) - [Printed Electronics](https://www.brewerscience.com/products/printed-sensor-systems/) - [Flex Sensors](https://www.brewerscience.com/products/inflect-flex-sensor/) - [Moisture Sensors](https://www.brewerscience.com/products/inflect-moisture-sensor/) - [Thermistor](https://www.brewerscience.com/products/inflect-thermistor/) - [Manufacturing](https://www.brewerscience.com/manufacturing/) - [Support](https://www.brewerscience.com/support/) - [About Us](https://www.brewerscience.com/about-us/) - [Executive Advisory Board](https://www.brewerscience.com/about-us/executive-advisory-board/) - [Quality, Environmental and Safety](https://www.brewerscience.com/about-us/environmental-safety/) - [Privacy](https://www.brewerscience.com/about-us/privacy/) - [Company](https://www.brewerscience.com/about-us/company/) - [What We Do](https://www.brewerscience.com/about-us/what-we-do/) - [Community Giving](https://www.brewerscience.com/about-us/community-giving/) - [Locations](https://www.brewerscience.com/about-us/locations/) - [Awards](https://www.brewerscience.com/about-us/awards/) - [Partnerships](https://www.brewerscience.com/about-us/partnerships/) - [News](https://www.brewerscience.com/newsroom/) - [Events](https://www.brewerscience.com/newsroom/events/) - [Press Releases](https://www.brewerscience.com/newsroom/press-releases/) - [Videos](https://www.brewerscience.com/newsroom/videos/) - [Ebooks](https://www.brewerscience.com/newsroom/ebooks/) - [Blog](https://www.brewerscience.com/newsroom/blog/) Search this site on Google Search Google # Blog Filter by Category [show all](https://blog.brewerscience.com/) [Wafer-Level Packaging](https://blog.brewerscience.com/topic/wafer-level-packaging) [Lithography](https://blog.brewerscience.com/topic/lithography) [New Business Developement](https://blog.brewerscience.com/topic/new-business-developement) [Company](https://blog.brewerscience.com/topic/company) [Other](https://blog.brewerscience.com/topic/other) Filter by Category - [Show All](https://blog.brewerscience.com/) ### Posts by Topic - [company (22)](https://blog.brewerscience.com/topic/company) - [Brewer Science (21)](https://blog.brewerscience.com/topic/brewer-science) - [wafer-level packaging (20)](https://blog.brewerscience.com/topic/wafer-level-packaging) - [other (19)](https://blog.brewerscience.com/topic/other) - [lithography (15)](https://blog.brewerscience.com/topic/lithography) - [sensors (13)](https://blog.brewerscience.com/topic/sensors) - [STEM (9)](https://blog.brewerscience.com/topic/stem) - [Technology (8)](https://blog.brewerscience.com/topic/technology) - [innovation (7)](https://blog.brewerscience.com/topic/innovation) - [DSA (6)](https://blog.brewerscience.com/topic/dsa) - [Internet of Things (6)](https://blog.brewerscience.com/topic/internet-of-things) - [new business developement (6)](https://blog.brewerscience.com/topic/new-business-developement) - [printed electronics (6)](https://blog.brewerscience.com/topic/printed-electronics) - [Directed Self-Assembly (5)](https://blog.brewerscience.com/topic/directed-self-assembly) - [Internships (5)](https://blog.brewerscience.com/topic/internships) - [Science, (5)](https://blog.brewerscience.com/topic/science) - [Sustainability (5)](https://blog.brewerscience.com/topic/sustainability) - [community (5)](https://blog.brewerscience.com/topic/community) - [development (5)](https://blog.brewerscience.com/topic/development) - [Engineering (4)](https://blog.brewerscience.com/topic/engineering) - [Integrated Circuits (4)](https://blog.brewerscience.com/topic/integrated-circuits) - [Leadership (4)](https://blog.brewerscience.com/topic/leadership) - [Math (4)](https://blog.brewerscience.com/topic/math) - [Predictive Maintenance (4)](https://blog.brewerscience.com/topic/predictive-maintenance) - [coat uniformity (4)](https://blog.brewerscience.com/topic/coat-uniformity) - [research (4)](https://blog.brewerscience.com/topic/research) - [technology advancement (4)](https://blog.brewerscience.com/topic/technology-advancement) - [AI (3)](https://blog.brewerscience.com/topic/ai) - [B Corp (3)](https://blog.brewerscience.com/topic/b-corp) - [Datastream (3)](https://blog.brewerscience.com/topic/datastream) - [FOWLP (3)](https://blog.brewerscience.com/topic/fowlp) - [Future Leaders (3)](https://blog.brewerscience.com/topic/future-leaders) - [GreenCircle Certified (3)](https://blog.brewerscience.com/topic/greencircle-certified) - [Manufacturing (3)](https://blog.brewerscience.com/topic/manufacturing) - [Problem Solving (3)](https://blog.brewerscience.com/topic/problem-solving) - [business (3)](https://blog.brewerscience.com/topic/business) - [education (3)](https://blog.brewerscience.com/topic/education) - [moisture sensors (3)](https://blog.brewerscience.com/topic/moisture-sensors) - [planarization (3)](https://blog.brewerscience.com/topic/planarization) - [processing equipment (3)](https://blog.brewerscience.com/topic/processing-equipment) - [quality control (3)](https://blog.brewerscience.com/topic/quality-control) - [semiconductor manufacturing (3)](https://blog.brewerscience.com/topic/semiconductor-manufacturing) - [semiconductors (3)](https://blog.brewerscience.com/topic/semiconductors) - [spin coat (3)](https://blog.brewerscience.com/topic/spin-coat) - [temporary bonding materials (3)](https://blog.brewerscience.com/topic/temporary-bonding-materials) - [thin wafer handling (3)](https://blog.brewerscience.com/topic/thin-wafer-handling) - [wearable electronics (3)](https://blog.brewerscience.com/topic/wearable-electronics) - [zero defects (3)](https://blog.brewerscience.com/topic/zero-defects) - [2017 (2)](https://blog.brewerscience.com/topic/2017) - [2d (2)](https://blog.brewerscience.com/topic/2d) - [3D Stacking (2)](https://blog.brewerscience.com/topic/3d-stacking) - [3D packaging (2)](https://blog.brewerscience.com/topic/3d-packaging) - [3d (2)](https://blog.brewerscience.com/topic/3d) - [BrewerBOND (2)](https://blog.brewerscience.com/topic/brewerbond) - [CS ManTech (2)](https://blog.brewerscience.com/topic/cs-mantech) - [Children (2)](https://blog.brewerscience.com/topic/children) - [Convanta (2)](https://blog.brewerscience.com/topic/convanta) - [Corning (2)](https://blog.brewerscience.com/topic/corning) - [Creativity (2)](https://blog.brewerscience.com/topic/creativity) - [DRIE (2)](https://blog.brewerscience.com/topic/drie) - [Drones (2)](https://blog.brewerscience.com/topic/drones) - [EUV (2)](https://blog.brewerscience.com/topic/euv) - [Energy Management (2)](https://blog.brewerscience.com/topic/energy-management) - [Fan-Out Wafer Level Packaging (2)](https://blog.brewerscience.com/topic/fan-out-wafer-level-packaging) - [IoT (2)](https://blog.brewerscience.com/topic/iot) - [IotT (2)](https://blog.brewerscience.com/topic/iott) - [MEMS (2)](https://blog.brewerscience.com/topic/mems) - [Nanotechnology (2)](https://blog.brewerscience.com/topic/nanotechnology) - [Potential (2)](https://blog.brewerscience.com/topic/potential) - [SEMICON Japan (2)](https://blog.brewerscience.com/topic/semicon-japan) - [STEM Jobs (2)](https://blog.brewerscience.com/topic/stem-jobs) - [TSV (2)](https://blog.brewerscience.com/topic/tsv) - [Toys (2)](https://blog.brewerscience.com/topic/toys) - [Walter Barnes (2)](https://blog.brewerscience.com/topic/walter-barnes) - [Zero Waste to Landfill (2)](https://blog.brewerscience.com/topic/zero-waste-to-landfill) - [advanced materials (2)](https://blog.brewerscience.com/topic/advanced-materials) - [advanced packaging (2)](https://blog.brewerscience.com/topic/advanced-packaging) - [advanced technology (2)](https://blog.brewerscience.com/topic/advanced-technology) - [advanved lithography (2)](https://blog.brewerscience.com/topic/advanved-lithography) - [benchtop equipment (2)](https://blog.brewerscience.com/topic/benchtop-equipment) - [blogs (2)](https://blog.brewerscience.com/topic/blogs) - [carbon nanotubes (2)](https://blog.brewerscience.com/topic/carbon-nanotubes) - [cnt (2)](https://blog.brewerscience.com/topic/cnt) - [culture (2)](https://blog.brewerscience.com/topic/culture) - [disruptive materials (2)](https://blog.brewerscience.com/topic/disruptive-materials) - [entrepreneurs (2)](https://blog.brewerscience.com/topic/entrepreneurs) - [environment (2)](https://blog.brewerscience.com/topic/environment) - [environmental monitoring (2)](https://blog.brewerscience.com/topic/environmental-monitoring) - [etch protection (2)](https://blog.brewerscience.com/topic/etch-protection) - [human resources (2)](https://blog.brewerscience.com/topic/human-resources) - [inflect sensors (2)](https://blog.brewerscience.com/topic/inflect-sensors) - [infrastructure management (2)](https://blog.brewerscience.com/topic/infrastructure-management) - [mems and sensors (2)](https://blog.brewerscience.com/topic/mems-and-sensors) - [moore's law (2)](https://blog.brewerscience.com/topic/moores-law) - [multilayer (2)](https://blog.brewerscience.com/topic/multilayer) - [nanoscience (2)](https://blog.brewerscience.com/topic/nanoscience) - [nanosensors (2)](https://blog.brewerscience.com/topic/nanosensors) - [oculus rift (2)](https://blog.brewerscience.com/topic/oculus-rift) - [olympics (2)](https://blog.brewerscience.com/topic/olympics) - [quality (2)](https://blog.brewerscience.com/topic/quality) - [scratch-resistant (2)](https://blog.brewerscience.com/topic/scratch-resistant) - [spin process (2)](https://blog.brewerscience.com/topic/spin-process) - [spincoat (2)](https://blog.brewerscience.com/topic/spincoat) - [supply chain (2)](https://blog.brewerscience.com/topic/supply-chain) - [thermal slide debonding (2)](https://blog.brewerscience.com/topic/thermal-slide-debonding) - [thick-film (2)](https://blog.brewerscience.com/topic/thick-film) - [wet etching (2)](https://blog.brewerscience.com/topic/wet-etching) - [193-nm (1)](https://blog.brewerscience.com/topic/193-nm) - [2.5d (1)](https://blog.brewerscience.com/topic/2-5d) - [3-D Stacking (1)](https://blog.brewerscience.com/topic/3-d-stacking) - [3D printing (1)](https://blog.brewerscience.com/topic/3d-printing) - [Adhesives (1)](https://blog.brewerscience.com/topic/adhesives) - [Anniversary (1)](https://blog.brewerscience.com/topic/anniversary) - [Anthem (1)](https://blog.brewerscience.com/topic/anthem) - [Apogee (1)](https://blog.brewerscience.com/topic/apogee) - [Arkema (1)](https://blog.brewerscience.com/topic/arkema) - [Art (1)](https://blog.brewerscience.com/topic/art) - [Artifical Intelligence (1)](https://blog.brewerscience.com/topic/artifical-intelligence) - [Becky Rich (1)](https://blog.brewerscience.com/topic/becky-rich) - [Biometric Sensors (1)](https://blog.brewerscience.com/topic/biometric-sensors) - [BrewerBOND 220 (1)](https://blog.brewerscience.com/topic/brewerbond-220) - [Building and Home Automation (1)](https://blog.brewerscience.com/topic/building-and-home-automation) - [CMOS (1)](https://blog.brewerscience.com/topic/cmos) - [CSAM (1)](https://blog.brewerscience.com/topic/csam) - [CTE (1)](https://blog.brewerscience.com/topic/cte) - [Compound Semiconductor Manufacturing (1)](https://blog.brewerscience.com/topic/compound-semiconductor-manufacturing) - [Covanta Energy (1)](https://blog.brewerscience.com/topic/covanta-energy) - [Debonding Process (1)](https://blog.brewerscience.com/topic/debonding-process) - [Derby (1)](https://blog.brewerscience.com/topic/derby) - [EfW (1)](https://blog.brewerscience.com/topic/efw) - [Electronics (1)](https://blog.brewerscience.com/topic/electronics) - [FHE (1)](https://blog.brewerscience.com/topic/fhe) - [Farming (1)](https://blog.brewerscience.com/topic/farming) - [GaN roughening (1)](https://blog.brewerscience.com/topic/gan-roughening) - [Gartner Hype Scale (1)](https://blog.brewerscience.com/topic/gartner-hype-scale) - [Gartner Inc. (1)](https://blog.brewerscience.com/topic/gartner-inc) - [Geothermal (1)](https://blog.brewerscience.com/topic/geothermal) - [Goals (1)](https://blog.brewerscience.com/topic/goals) - [Heat (1)](https://blog.brewerscience.com/topic/heat) - [IMAPs (1)](https://blog.brewerscience.com/topic/imaps) - [Inflect Moisture Sensor (1)](https://blog.brewerscience.com/topic/inflect-moisture-sensor) - [IofT (1)](https://blog.brewerscience.com/topic/ioft) - [LED manufacturing (1)](https://blog.brewerscience.com/topic/led-manufacturing) - [Lateral Force (1)](https://blog.brewerscience.com/topic/lateral-force) - [Medical and Health-Care Systems (1)](https://blog.brewerscience.com/topic/medical-and-health-care-systems) - [NASA (1)](https://blog.brewerscience.com/topic/nasa) - [National Chemistry Week (1)](https://blog.brewerscience.com/topic/national-chemistry-week) - [National Guardsman (1)](https://blog.brewerscience.com/topic/national-guardsman) - [National Manufacturing Day (1)](https://blog.brewerscience.com/topic/national-manufacturing-day) - [PLTW (1)](https://blog.brewerscience.com/topic/pltw) - [Polymers (1)](https://blog.brewerscience.com/topic/polymers) - [R & D (1)](https://blog.brewerscience.com/topic/r-d) - [RDL-first (1)](https://blog.brewerscience.com/topic/rdl-first) - [Rama Puligadda (1)](https://blog.brewerscience.com/topic/rama-puligadda) - [Ray Kurzweil (1)](https://blog.brewerscience.com/topic/ray-kurzweil) - [SEMI (1)](https://blog.brewerscience.com/topic/semi) - [SEMICON Taiwan (1)](https://blog.brewerscience.com/topic/semicon-taiwan) - [SMC (1)](https://blog.brewerscience.com/topic/smc) - [SOC Materials (1)](https://blog.brewerscience.com/topic/soc-materials) - [STEAM (1)](https://blog.brewerscience.com/topic/steam) - [Scratch-resistant sensors (1)](https://blog.brewerscience.com/topic/scratch-resistant-sensors) - [Selective Surface Modification (1)](https://blog.brewerscience.com/topic/selective-surface-modification) - [Semuconductors (1)](https://blog.brewerscience.com/topic/semuconductors) - [Strategic Materials Conference (1)](https://blog.brewerscience.com/topic/strategic-materials-conference) - [Temporary Bonding (1)](https://blog.brewerscience.com/topic/temporary-bonding) - [Thermal Stability (1)](https://blog.brewerscience.com/topic/thermal-stability) - [Transportation (1)](https://blog.brewerscience.com/topic/transportation) - [Truck Drivers (1)](https://blog.brewerscience.com/topic/truck-drivers) - [Vehicle (1)](https://blog.brewerscience.com/topic/vehicle) - [ZoneBOND (1)](https://blog.brewerscience.com/topic/zonebond) - [adafruit (1)](https://blog.brewerscience.com/topic/adafruit) - [analytical group (1)](https://blog.brewerscience.com/topic/analytical-group) - [anti-reflective coating (1)](https://blog.brewerscience.com/topic/anti-reflective-coating) - [anti-reflective coatings (1)](https://blog.brewerscience.com/topic/anti-reflective-coatings) - [arc materials (1)](https://blog.brewerscience.com/topic/arc-materials) - [arts (1)](https://blog.brewerscience.com/topic/arts) - [autonomous car (1)](https://blog.brewerscience.com/topic/autonomous-car) - [back-end processes (1)](https://blog.brewerscience.com/topic/back-end-processes) - [batteries (1)](https://blog.brewerscience.com/topic/batteries) - [bureau veritas certifications (1)](https://blog.brewerscience.com/topic/bureau-veritas-certifications) - [cee (1)](https://blog.brewerscience.com/topic/cee) - [chemical engineering (1)](https://blog.brewerscience.com/topic/chemical-engineering) - [chemical stability (1)](https://blog.brewerscience.com/topic/chemical-stability) - [data logging (1)](https://blog.brewerscience.com/topic/data-logging) - [debonder (1)](https://blog.brewerscience.com/topic/debonder) - [debonding (1)](https://blog.brewerscience.com/topic/debonding) - [debonding materials (1)](https://blog.brewerscience.com/topic/debonding-materials) - [depth-of-focus (1)](https://blog.brewerscience.com/topic/depth-of-focus) - [devices (1)](https://blog.brewerscience.com/topic/devices) - [digitsole (1)](https://blog.brewerscience.com/topic/digitsole) - [eWLB (1)](https://blog.brewerscience.com/topic/ewlb) - [eco-friendly (1)](https://blog.brewerscience.com/topic/eco-friendly) - [economics (1)](https://blog.brewerscience.com/topic/economics) - [embedded wafer-level (1)](https://blog.brewerscience.com/topic/embedded-wafer-level) - [energy-from-waste (1)](https://blog.brewerscience.com/topic/energy-from-waste) - [environmental (1)](https://blog.brewerscience.com/topic/environmental) - [environmental standards (1)](https://blog.brewerscience.com/topic/environmental-standards) - [etching (1)](https://blog.brewerscience.com/topic/etching) - [facial recognition (1)](https://blog.brewerscience.com/topic/facial-recognition) - [fitbit (1)](https://blog.brewerscience.com/topic/fitbit) - [flexible electronics (1)](https://blog.brewerscience.com/topic/flexible-electronics) - [flexible sensors (1)](https://blog.brewerscience.com/topic/flexible-sensors) - [fossil fuel (1)](https://blog.brewerscience.com/topic/fossil-fuel) - [glass (1)](https://blog.brewerscience.com/topic/glass) - [grid array (1)](https://blog.brewerscience.com/topic/grid-array) - [hardmask (1)](https://blog.brewerscience.com/topic/hardmask) - [higher education (1)](https://blog.brewerscience.com/topic/higher-education) - [idtechex (1)](https://blog.brewerscience.com/topic/idtechex) - [industry 4.0 (1)](https://blog.brewerscience.com/topic/industry-4-0) - [inflect flex sensor (1)](https://blog.brewerscience.com/topic/inflect-flex-sensor) - [insoluble (1)](https://blog.brewerscience.com/topic/insoluble) - [integration (1)](https://blog.brewerscience.com/topic/integration) - [intellectual property (1)](https://blog.brewerscience.com/topic/intellectual-property) - [inventors day (1)](https://blog.brewerscience.com/topic/inventors-day) - [landfill (1)](https://blog.brewerscience.com/topic/landfill) - [laser debonding (1)](https://blog.brewerscience.com/topic/laser-debonding) - [laser release (1)](https://blog.brewerscience.com/topic/laser-release) - [law (1)](https://blog.brewerscience.com/topic/law) - [lithographic (1)](https://blog.brewerscience.com/topic/lithographic) - [lithographic composition (1)](https://blog.brewerscience.com/topic/lithographic-composition) - [management (1)](https://blog.brewerscience.com/topic/management) - [mechanical release (1)](https://blog.brewerscience.com/topic/mechanical-release) - [media (1)](https://blog.brewerscience.com/topic/media) - [memory (1)](https://blog.brewerscience.com/topic/memory) - [multi-layer (1)](https://blog.brewerscience.com/topic/multi-layer) - [nano technologies (1)](https://blog.brewerscience.com/topic/nano-technologies) - [optical simulations (1)](https://blog.brewerscience.com/topic/optical-simulations) - [pebble watch (1)](https://blog.brewerscience.com/topic/pebble-watch) - [personality traits (1)](https://blog.brewerscience.com/topic/personality-traits) - [photolithography (1)](https://blog.brewerscience.com/topic/photolithography) - [pixie scientific (1)](https://blog.brewerscience.com/topic/pixie-scientific) - [planarized substrates (1)](https://blog.brewerscience.com/topic/planarized-substrates) - [powerlifting (1)](https://blog.brewerscience.com/topic/powerlifting) - [process engineer (1)](https://blog.brewerscience.com/topic/process-engineer) - [prolith (1)](https://blog.brewerscience.com/topic/prolith) - [protective coatings (1)](https://blog.brewerscience.com/topic/protective-coatings) - [pure enjoyment (1)](https://blog.brewerscience.com/topic/pure-enjoyment) - [purification (1)](https://blog.brewerscience.com/topic/purification) - [quell (1)](https://blog.brewerscience.com/topic/quell) - [recycling (1)](https://blog.brewerscience.com/topic/recycling) - [research and development (1)](https://blog.brewerscience.com/topic/research-and-development) - [rio (1)](https://blog.brewerscience.com/topic/rio) - [rugby (1)](https://blog.brewerscience.com/topic/rugby) - [safety (1)](https://blog.brewerscience.com/topic/safety) - [scientific computing (1)](https://blog.brewerscience.com/topic/scientific-computing) - [silicon wafers (1)](https://blog.brewerscience.com/topic/silicon-wafers) - [smart manufacturing (1)](https://blog.brewerscience.com/topic/smart-manufacturing) - [smart technology (1)](https://blog.brewerscience.com/topic/smart-technology) - [smart watches (1)](https://blog.brewerscience.com/topic/smart-watches) - [sms audio biosport earbuds (1)](https://blog.brewerscience.com/topic/sms-audio-biosport-earbuds) - [solar energy (1)](https://blog.brewerscience.com/topic/solar-energy) - [soluble (1)](https://blog.brewerscience.com/topic/soluble) - [space (1)](https://blog.brewerscience.com/topic/space) - [spin bowl (1)](https://blog.brewerscience.com/topic/spin-bowl) - [spin coaters (1)](https://blog.brewerscience.com/topic/spin-coaters) - [spin-on carbon (1)](https://blog.brewerscience.com/topic/spin-on-carbon) - [sports (1)](https://blog.brewerscience.com/topic/sports) - [square substrate (1)](https://blog.brewerscience.com/topic/square-substrate) - [substrate size (1)](https://blog.brewerscience.com/topic/substrate-size) - [surface modification (1)](https://blog.brewerscience.com/topic/surface-modification) - [temperature sensors (1)](https://blog.brewerscience.com/topic/temperature-sensors) - [temporary wafer bonding (1)](https://blog.brewerscience.com/topic/temporary-wafer-bonding) - [trilayer (1)](https://blog.brewerscience.com/topic/trilayer) - [trilayer resist process (1)](https://blog.brewerscience.com/topic/trilayer-resist-process) - [ultrathin wafers (1)](https://blog.brewerscience.com/topic/ultrathin-wafers) - [unilayer processing (1)](https://blog.brewerscience.com/topic/unilayer-processing) - [unplugged (1)](https://blog.brewerscience.com/topic/unplugged) - [wafer problems (1)](https://blog.brewerscience.com/topic/wafer-problems) - [water (1)](https://blog.brewerscience.com/topic/water) - [wearable devices (1)](https://blog.brewerscience.com/topic/wearable-devices) - [wearable solar (1)](https://blog.brewerscience.com/topic/wearable-solar) - [wireless headphones (1)](https://blog.brewerscience.com/topic/wireless-headphones) - [workplace safety (1)](https://blog.brewerscience.com/topic/workplace-safety) - [zero landfill (1)](https://blog.brewerscience.com/topic/zero-landfill) # 2018 Outlook for Advanced Packaging Materials [Ramachandran Trichur](https://blog.brewerscience.com/author/ramachandran-trichur) Feb 08, 2018 ### Subscribe to Our Blog ![Ram-Trichur-Bio-Photo-150x150.png](https://blog.brewerscience.com/hubfs/social-suggested-images/Ram-Trichur-Bio-Photo-150x150.png)Advanced packaging is moving mainstream as manufacturers continue to seek ways to improve device performance beyond traditional scaling. The semiconductor industry is also witnessing increasing investments in packaging, in terms of capabilities, capacity, and infrastructure from the assembly and packaging houses. All this attention on packaging is primarily driven by the need to deliver highly integrated, high-performance devices while addressing concerns for lower cost, lower power consumption, and reduction in form factor. From our perspective as a supplier of advanced packaging materials and a dominant player in the advanced packaging supply chain, we see a multitude of applications driving our growth in 2018 and beyond. In fan-out packaging, there are several challenges being addressed at the wafer level and panel level by all participants in the value chain, including suppliers of advanced packaging materials. Predominantly, warpage, handling, and die-shift issues in reconstituted substrates continue to test the limits of current process capabilities. As there is an assortment of mold compounds being used by manufacturers for creating the reconstituted wafers, the resulting warpage of the substrates is not easily controlled or predicted. Moreover, the warpage is also dependent on the die placement architecture and size and thickness of the substrate. Therefore, a simple and cost-effective carrier-assisted technology is sought to temporarily support the substrates during the downstream process. We also see rapid progress to set up RDL-first processes for fan-out packaging on both the wafer level and [panel level](https://www.3dincites.com/2017/10/panel-level-packaging-the-next-sleeping-giant-and-other-thoughts-from-iwlpc-2017/). Here, manufacturers primarily use a temporary build-up layer on glass carriers to build the RDL layers, followed by die attach, molding and other processes. We have developed innovative [temporary build-up layers](https://www.3dincites.com/2017/09/temporary-bonding-and-debonding-technologies-for-fan-out-wafer-level-packaging/) that are needed to support the processes, which involve harsh chemicals, and extended high-temperature exposures for polyimide curing and highly stressed layers during the fabrication. Moreover, the temporary build-up layers need to exhibit strong adhesion to metals and polyimides and be able to release cleanly using a laser debond method without damaging the active dies. Another area in which we predict rapid growth is advanced sensor manufacturing and packaging. Mobile electronics applications demand heterogeneous integration of sensors to other ICs and reduction in form factor of the sensor device. We provide temporary bonding materials for wafer thinning applications, TSV creation and backend packaging processes for the sensors. As 5G communications, autonomous driving and mobile electronics applications continue to develop, we see an increase in advanced packaging applications related to RF, MEMS, compound semiconductor and power devices. The front-end modules in communication chips require heavy heterogeneous integration to accommodate multiple filters, passives, RF ICs and other components in a very small package. 5G devices also need a small footprint, so advanced fan-out packaging processes may replace the popular flip-chip based SiP architectures. Here, we provide material and process capabilities for packaging these devices. We believe a new wave of applications and services will be enabled by the ever-growing network of connected devices. The hunger for denser integration and higher performance will continue to grow, to satisfy the needs of 5G communications, autonomous driving, connected healthcare and other mission-critical applications. We are excited about the future of semiconductor packaging, and we are prepared to deliver disruptive innovation in materials and processes technologies to further advance IC packaging. \*Originally posted on [3D InCites](https://www.3dincites.com/2018/01/2018-outlook-for-advanced-packaging-materials/). [advanced packaging](https://blog.brewerscience.com/topic/advanced-packaging), [Brewer Science](https://blog.brewerscience.com/topic/brewer-science) [Brewer Science sees a STEM future in Project Lead the Way](https://blog.brewerscience.com/brewer-science-sees-a-stem-future-in-project-lead-the-way) [Focusing and prioritizing what’s on your plate: 4 tips for your manufacturing team to embrace](https://blog.brewerscience.com/focusing-and-prioritizing-whats-on-your-plate-4-tips-for-your-manufacturing-team-to-embrace) ### About Author ![Ramachandran Trichur](https://blog.brewerscience.com/hubfs/social-suggested-images/Ram-Trichur-Bio-Photo-150x150.png) Ramachandran Trichur Ramachandran K. Trichur received his MS in Electrical Engineering from the U. of Cincinnati, and BS degree in Electrical and Electronics Engineering from Bharathidasan U.; he is a Director of Business Development at Brewer Science Inc.; Related Posts [![Brewer Science’s 10 Wastes to Become Lean](https://blog.brewerscience.com/hubfs/WastesLean-png.png) Brewer Science’s 10 Wastes to Become Lean](https://blog.brewerscience.com/brewer-sciences-10-wastes-to-become-lean) [![Turn Your Camera On – A Key to Better Meetings](https://blog.brewerscience.com/hubfs/Teams%20Backgrounds%20Group-png.png) Turn Your Camera On – A Key to Better Meetings](https://blog.brewerscience.com/turn-your-camera-on-a-key-to-better-meetings) [![Proactive Approach to Defect Reduction in the Supply Chain](https://blog.brewerscience.com/hubfs/image001-png.png) Proactive Approach to Defect Reduction in the Supply Chain](https://blog.brewerscience.com/proactive-approach-to-defect-reduction-in-the-supply-chain) - - - - ### Comment ## Subscribe To Blog ### Subscribe to Email Updates ### contact **Brewer Science, Inc.** 2401 Brewer Dr. Rolla, MO 65401 Call us: ([573)364-0300](tel:+1800123456) ### support At Brewer Science, our customer relationships don’t end when you buy materials and equipment. Because we want to work hand-in-hand to get your processes perfect, we’ve empowered an extensive applications and support team to help with all your processing needs. [SUPPORT@BREWERSCIENCE.COM](mailto:SUPPORT@BREWERSCIENCE.COM) [Locations](https://blog.brewerscience.com/about-us/locations/) ### Recent Posts ### connect with us @ 2018 Brewer Science, inc.