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Process methodologies for temporary thin wafer handling solutions

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Use of temporary bonding/debonding as part of thin wafer handling processes is rapidly increasing. Users must determine which temporary bonding/debonding method is appropriate for a specific application. Some of the technologies that have been developed are chemical release, thermal slide separation, and ZoneBOND® debonding.

types of debonding

The chemical release process requires very little force to release the thinned device wafers from carriers and is recommended for low-volume, small-format, and compound semiconductor (CS) III-V materials.

The thermal slide debonding process is ideal for small-format applications with throughput requirements of 500-600 wafers (50-150 mm in diameter) per week and with thermal budgets up to 220°C.

The ZoneBOND® process is capable of separating large-format wafer pairs (with diameters of 200 mm or larger) containing large topography and/or perforations. It is also compatible with all wafer sizes, thicknesses, materials, and surface topographies.

Download the white paper to learn more about these three thin wafer handling process methodologies.

 

Thermal slide debonding for temporary bonding processes (Part 3 of 3)
Directed Self-Assembly

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Nick Skelton

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