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Wafer-Level Packaging and the Mobile Revolution

Back in September and this past March, Apple held its biannual Special Events. These events are meant to introduce new products and features, and they happen quite regularly. These two recent events, however, seemed to leave something out: computers.

Topics: Integrated Circuits, wafer-level packaging, FOWLP, 2d, 3d

Brewer Science technology, forecasts highlighted in Chip Scale Review

In recognition of its progress with temporary bonding and thin wafer handling, Brewer Science was featured in the November/December issue of Chip Scale Review.

Topics: debonding materials, advanced packaging, wafer-level packaging, FOWLP

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