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Wafer-Level Packaging and the Mobile Revolution

Back in September and this past March, Apple held its biannual Special Events. These events are meant to introduce new products and features, and they happen quite regularly. These two recent events, however, seemed to leave something out: computers.

Topics: Integrated Circuits, wafer-level packaging, FOWLP, 2d, 3d

The Road to 3D Integration

“Just the tip of the iceberg.”

Topics: 2d, 2.5d, integration, 3d

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