Processing wafers with high-topography 3-D structures

43-µm deep pillars with oxide hard mask remainingExtreme trench fillingVia filling

Topics: TSV, planarization

Photosensitive etch mask for creating through-silicon vias (TSVs)

Through-silicon vias (TSVs) are becoming increasingly common for high-speed and high-bandwidth connections on a chip. TSVs are especially important in 3D packaging schemes and are also used in many sensor, MEMS, and LED devices.

Topics: etch protection, wet etching, TSV