Tue, Feb 09, 2016 @ 10:27 AM
In recognition of its progress with temporary bonding and thin wafer handling, Brewer Science was featured in the November/December issue of Chip Scale Review.
The feature discusses the company’s use of wafer-level packaging (WLP) technologies in semiconductor segments, including fan-out WLP (FOWLP); fan-in wafer-level chip-scale package (FI-WLCSP); 3-D FOWLP; 2.5-D integration with interposer technology; and true 3-D IC integration using through-silicon via (TSV) interconnects. The authors are Ramachandran K. Trichur, Business Development Manager for Temporary Bonding, and Dr. Tony D. Flaim, Chief Technical Officer.
Brewer Science offers bonding and debonding materials, as well as wafer-handling expertise and on-site equipment setup and training. Its goal? Helping device makers and advanced packaging manufacturers take advantage of cost-efficient and reliable thin-substrate handling technologies to make smaller, faster, more highly integrated devices.
Other points covered by the authors include:
To read more about Brewer Science’s temporary bonding and thin wafer handling strategies, view the article “Temporary bonding and thin wafer handling strategies for semiconductor device processing” at http://fbs.advantageinc.com/chipscale/nov-dec_2015/#40.