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[Read More 11 Jul lithography Developer options for spin-on photosensitive materials Developing photosensitive film layers to produce features of targeted sizes is a critical process step within any photolithography application. Application engineers have created several processes.. Andrew Layton](https://blog.brewerscience.com/blog/bid/88562/developer-options-for-spin-on-photosensitive-materials) - [Read More 23 May coat uniformity thick-film other Bake plate enhancements for optimal thick-film curing results High-uniformity bake plates have been displacing convection ovens for well over two decades in the microelectronics industry. The disadvantages of variable temperature zones, lengthened cure times,.. Andrew Layton](https://blog.brewerscience.com/blog/bid/87065/bake-plate-enhancements-for-optimal-thick-film-curing-results) - [Read More 21 May TSV planarization wafer-level packaging Processing wafers with high-topography 3-D structures Over the past decade, Brewer Science has developed and published various methods of creating a planar surface over three-dimensional (3-D) structures. Sharing these results invariably leads to a.. Andrew Layton](https://blog.brewerscience.com/blog/bid/86994/processing-wafers-with-high-topography-3-d-structures) - [Read More 21 May community education unplugged company Jim Lamb at Science Cafe At the Science Café event held at Farmers Gastropub on April 19, James E. (Jim) Lamb III, Brewer Science Corporate Technology Strategist and Director of the Printed Electronics Technology Center,.. Andrew Layton](https://blog.brewerscience.com/blog/bid/86687/jim-lamb-at-science-cafe) - [Read More 27 Mar lithography multilayer Background of multilayer processing As semiconductor devices evolve, smaller and smaller feature sizes are required to achieve the performance desired by the consumer. Smaller features give rise to lower power consumption for mobile.. Andrew Layton](https://blog.brewerscience.com/blog/bid/84444/background-of-multilayer-processing) - [Read More 21 Mar spin coat coat uniformity thick-film wafer-level packaging Solvent vapor control for optimal thick-film spin coating One of the most critical variables in spin-coating processes is coating uniformity. In many cases, engineers are challenged with achieving ultralow total thickness variation at high film thicknesses.. Andrew Layton](https://blog.brewerscience.com/blog/bid/84268/solvent-vapor-control-for-optimal-thick-film-spin-coating) - [Read More 22 Feb etch protection wet etching TSV other Photosensitive etch mask for creating through-silicon vias (TSVs) Through-silicon vias (TSVs) are becoming increasingly common for high-speed and high-bandwidth connections on a chip. TSVs are especially important in 3D packaging schemes and are also used in many.. Andrew Layton](https://blog.brewerscience.com/blog/bid/82907/photosensitive-etch-mask-for-creating-through-silicon-vias-tsvs) - [Read More 07 Feb lithography EUV multilayer Lithography process simplification for reduced cost of ownership Cost of ownership plays an important role in lithography process materials and methods decisions. Process simplifications brought about by layer-to-layer synergy drive significant cost of ownership.. Andrew Layton](https://blog.brewerscience.com/blog/bid/82058/lithography-process-simplification-for-reduced-cost-of-ownership) - ### [Read More 26 Jan 3D packaging supply chain Supply chain flexibility for 3D device packaging Limitations of Moore's Law Ultimately, performance of computers and other electronic products will be limited by transistor size and density. Because the semiconductor industry has pushed to.. Andrew Layton](https://blog.brewerscience.com/blog/bid/81672/supply-chain-flexibility-for-3d-device-packaging) - [Read More 17 Jan DRIE etch protection GaN roughening wet etching LED manufacturing Protecting key device features during wet-etch processing With the explosion in demand for devices that include features in the tens to hundreds of microns, wet-etching is seeing new relevance. Light-emitting diodes (LED), microfluidic devices, ink-jet.. Andrew Layton](https://blog.brewerscience.com/blog/bid/81283/protecting-key-device-features-during-wet-etch-processing) [1](https://blog.brewerscience.com/author/andrew-layton/page/1) [2](https://blog.brewerscience.com/author/andrew-layton/page/2) ### Comment ## Subscribe To Blog ### Subscribe to Email Updates ### contact **Brewer Science, Inc.** 2401 Brewer Dr. Rolla, MO 65401 Call us: ([573)364-0300](tel:+1800123456) ### support At Brewer Science, our customer relationships don’t end when you buy materials and equipment. 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