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The microelectronics industry is rapidly migrating to fabricating 3-D wafer stacking interconnects using through-silicon via (TSV) technology. Major market segments seeking to benefit from TSV..

Developing photosensitive film layers to produce features of targeted sizes is a critical process step within any photolithography application. Application engineers have created several processes..

High-uniformity bake plates have been displacing convection ovens for well over two decades in the microelectronics industry. The disadvantages of variable temperature zones, lengthened cure times,..

Over the past decade, Brewer Science has developed and published various methods of creating a planar surface over three-dimensional (3-D) structures. Sharing these results invariably leads to a..

At the Science Café event held at Farmers Gastropub on April 19, James E. (Jim) Lamb III, Brewer Science Corporate Technology Strategist and Director of the Printed Electronics Technology Center,..

As semiconductor devices evolve, smaller and smaller feature sizes are required to achieve the performance desired by the consumer. Smaller features give rise to lower power consumption for mobile..

One of the most critical variables in spin-coating processes is coating uniformity. In many cases, engineers are challenged with achieving ultralow total thickness variation at high film thicknesses..

Through-silicon vias (TSVs) are becoming increasingly common for high-speed and high-bandwidth connections on a chip. TSVs are especially important in 3D packaging schemes and are also used in many..

Thin-wafer processing trends

Several spin-coating process applications require the ability to uniformly coat, develop, and/or rinse (clean) thinned and fragile substrates. Safely handling these..